VIA Boasts Growing Support for the C3 in Russia
May 27, 2002

Moscow, Russia, 23 April 2002 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced growing support for its VIA C3™ processors from leading system assemblers in Russia.

With its leading-edge 0.13-micron manufacturing processes and boasting the world's smallest x86 processor die size, the VIA C3™ processor is the coolest running processor on the market today and delivers ultra low power consumption and world class levels of stability. Other features include 128KB Level 1 and 64KB Level 2 full speed cache, as well as support for a 100/133MHz Front Side Bus. Speeds of up to 933MHz and support for MMX™ and 3DNow! multimedia instructions ensure robust levels of performance for all the most popular mainstream software and Internet applications.

"The VIA C3™ processor provides manufacturers with the right platform to bring to market small, quiet and fanless designs," said Richard Brown, Director of International Marketing at VIA Technologies, Inc. "This is possible thanks to the unique features of VIA C3™ processors: ultra low power consumption and heat dissipation. Extensive feedback from the market proves this very well."

Read the full press release here

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